Product Description
Standex Electronics U Series Reed Relay; Surface Mount; 1A SPST-NO; 3 VDC; 3A; 100; J-Lead
Reed Relay • Mounting: Surface Mount (SMD) • Contact Form: 1A SPST-NO • Coil Voltage: 3 VDC • Switching Voltage: 100 • Termination: J-Lead • Special Feature: High RF 8 GHz
Product Information
| Manufacturer | Standex Electronics |
| Product Category | Relay |
| Product Sub Category | Reed Relay |
| Series | U Series |
| Catalog Part Number | UJ-103RF |
Specifications
| Product Attribute | Attribute Value |
|---|---|
| Mounting | Surface Mount (SMD) |
| Contact Form | 1A SPST-NO |
| Coil Voltage | 3 VDC |
| Switching Voltage | 100 |
| Switching Current (max.) | 3A |
| Termination | J-Lead |
| Special Feature | High RF 8 GHz |
Series Features
U Series Reed Relay
Series DescriptionThe U Series is an ultraminiature, high-frequency reed relay designed for advanced RF switching in space-constrained PCB layouts. With a compact surface-mount footprint and J-Lead packaging, the U Series delivers exceptional RF performance up to 8 GHz, making it ideal for automated test equipment (ATE), telecommunications, and wireless communication systems.
Engineered to balance miniature size with high-frequency capability, the U Series supports SPST-NO (Form A) contact configuration and coil voltages of 3.3 VDC and 5 VDC. Rated for up to 3 W, 100 VDC, and 0.2 A, it offers low insertion loss and reliable signal integrity in high-density assemblies.
- Ultraminiature SMD footprint for high-density PCB layouts
- RF performance up to 8 GHz with low insertion loss
- Contact configuration: SPST-NO (Form A)
- Rated for 3 W, 100 VDC, and 0.2 A switching capacity
- Coil voltage options: 3.3 VDC and 5 VDC
- Coil resistance: Max. 150 Ω
- J-Lead surface-mount packaging for compact integration
- Optimized for high-frequency and high-density applications
Automated Test Equipment (ATE): RF switching in pin-electronics and load boards
Functional PCB Testing: High-frequency signal routing in compact designs
Data Acquisition Systems: Reliable switching in precision instruments
Telecommunications: RF signal control in wireless infrastructure
IC Wafer Testing: High-speed switching in semiconductor diagnostics
Wireless Communications: Compact relay integration in RF modules