Product Description
Standex Electronics MH Series Reed Relay;Surface Mount (SMD); 12 VDC; 1C SPDT; 10 Amps; J-Lead; High RF 3 GHz
Reed Relay • Reed Relay • Mounting : Surface Mount (SMD) • Coil voltage: 12 VDC • Contact Configuration: 1C SPDT • Contact Rating: 10 Amps • Featrure: High RF 3 GHz • Termination Style: J-Lead
Product Information
| Manufacturer | Standex Electronics |
| Product Category | Relay |
| Product Sub Category | Reed Relay |
| Series | MH Series |
| Catalog Part Number | MH-E1T12JH |
Specifications
| Product Attribute | Attribute Value |
|---|---|
| Mounting | Surface Mount (SMD) |
| Coil voltage | 12 VDC |
| Contact Configuration | 1C SPDT |
| Contact Rating | 10 Amps |
| Switching Voltage | 100 V |
| Coil Current | 0.5 |
| Coil Type | Non Latching |
| Featrure | High RF 3 GHz |
| Termination Style | J-Lead |
| Must Operate Voltage VDC | 8.8 |
| Must Release Voltage VDC | 1.2 |
| Operate Time | 0.5 |
| Release Time | 0.5 |
| Operating Temperature | -20ËšC to +60ËšC |
Series Features
MH Series Reed Relay
Series DescriptionThe MH Series is a high-density reed relay engineered for precision switching in compact PCB layouts. Featuring a vertical form factor optimized for space efficiency, the MH Series enables dense relay arrays ideal for demanding applications such as automated test equipment (ATE), telecommunications, and medical diagnostics.
With a footprint designed for high-density mounting, the MH Series supports SPST-NO (Form A) contact configurations and is available in 5 VDC and 12 VDC coil voltage options. Rated for up to 5 W, 50 VDC, and 0.2 A, it ensures reliable performance in low-power switching environments. Through-hole vertical mounting provides secure integration, while optional diode protection and shielding enhance isolation and longevity.
- High-density vertical form factor for compact PCB assembly
- SPST-NO (Form A) contact configuration
- Rated for 5 W, 50 VDC, and 0.2 A switching capacity
- Coil voltage options: 5 VDC and 12 VDC
- Through-hole (THT) vertical mounting for robust placement
- Optional diode protection for coil suppression
- Single/double shielding options for improved signal isolation
- Relay socket options for simplified maintenance and replacement
- Optimized for IC testing and automated test environments
Automated test equipment, Functional PCB test systems, Data acquisition, telecommunications, ATE signal & PCB testers, High current/Voltage test, IC wafer testing, High density, High RF wireless and wireless communications markets.