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  • Coto B41-0002 Reed Relays

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    B41-0002

    Manufacturer Coto
    Manufacturer Product Number B41-0002

    This item is out of stock. Please submit an RFQ or call 800-526-5376 for pricing and delivery.

    Product Description

    Description: Reed Relays • Package: BGA • Contact Form: 4A 4PST-NO • Coil Voltage: 3.3 VDC • Switching Voltage: 125 • Switching Current: 0.25 • ES Shield: N/A • RF Coax Shield: N/A • Solder Alloy: SnPb Eutectic

          Product Information       Resources
    ManufacturerCoto Technology
    Product Category Relays
    Product Sub Category Reed Relays
    SeriesB41 Series
    		 
      Download Datasheet

      RoHS Compliant
          Specifications
    Product Attribute
    		Attribute Value
    PackageBGA
    Contact Form4A 4PST-NO
    Coil Voltage3.3 VDC
    Switching Voltage125
    Switching Current0.25
    ES ShieldN/A
    RF Coax ShieldN/A
    Solder AlloySnPb Eutectic
    Coil Resistance (? +/- 10%)55
    Operate Voltage (VDC Max.)2.4
    Release Voltage (VDC-Min.)0.4
    Carry Current (Amps)0.25
    Contact Rating (Watts)3
    Life Expectancy-Typical (x106 Ops.)1000
    Static Contact Resistance (max. init.) ?0.125
    Dynamic Contact Resistance (max. init.) ?0.15
    Insulation Resistance (minimum) - Between all Isolated Pins at 100V, 25°C, 40% RH1012
    Capacitance - Across Contact0.2 pF
    Open Contact to Coil0.3 pF
    Closed contact to Coil0.5 pF
    Dielectric Strength (minimum)Across Contacts: 150; Contact to Coil: 1000; Contact to Shield: 1000; Between Contacts of Adjacent Channels: 1000
    Operate Time - including bounce At Nominal Coil Voltage, 30 Hz Square Wave (msec.)0.1
    Release Time - Typical (msec.)0.03
    Breakdown Voltage150
    Switch Power (V/A)3
          Series Features
    B41 Series Ball Grid Array 4-Channel Relays
    Series Description: The B41 contains four independent form A channels in one planar quad package. Coto’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay perfor- mance. This patented technology1 allows for shorter RF paths in a controlled 50 ? en- vironment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. This four-in-one BGA packaging allows relays to be integrated easily on boards designed for surface mount processing.
    • Planar BGA Surface Mount
    • Ability to switch GHz signals
    • Rise time < 45 ?Sec
    • ~50? Characteristic Impedance
    • Low Capacitance
    • Patented Design
    • RoHS compliant solder (optional)

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