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  • Coto B10-05B Reed Relays

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    B10-05B

    Manufacturer Coto
    Manufacturer Product Number B10-05B

    This item is out of stock. Please submit an RFQ or call 800-526-5376 for pricing and delivery.

    Product Description

    Description: Reed Relays • Package: BGA • Contact Form: 1A SPST-NO • Coil Voltage: 5 VDC • Switching Voltage: 125 • Switching Current: 0.25 • ES Shield: N/A • RF Coax Shield: N/A

          Product Information       Resources
    ManufacturerCoto Technology
    Product Category Relays
    Product Sub Category Reed Relays
    SeriesB10 Series
    		 
      Download Datasheet

      RoHS Compliant
          Specifications
    Product Attribute
    		Attribute Value
    PackageBGA
    Contact Form1A SPST-NO
    Coil Voltage5 VDC
    Switching Voltage125
    Switching Current0.25
    ES ShieldN/A
    RF Coax ShieldN/A
    Coil Resistance (? +/- 10%)150
    Operate Voltage (VDC Max.)3.8
    Release Voltage (VDC-Min.)0.4
    Carry Current (Amps)0.5
    Contact Rating (Watts)3
    Life Expectancy-Typical (x106 Ops.)1000
    Static Contact Resistance (max. init.) ?0.125
    Dynamic Contact Resistance (max. init.) ?0.15
    Insulation Resistance (minimum) - Between all Isolated Pins at 100V, 25°C, 40% RH1012
    Capacitance - Across Contact0.2 pF
    Open Contact to Coil0.5 pF
    Closed contact to Coil1 pF
    Dielectric Strength (minimum)Between Contacts: 150; Contacts to Coil: 1500; Contacts to Shield: 1500
    Operate Time - including bounce At Nominal Coil Voltage, 30 Hz Square Wave (msec.)0.1
    Release Time - Typical (msec.)0.03
    Breakdown Voltage150
    Switch Power (V/A)3
          Series Features
    B10 RF Relays
    Series Description: CotoÂ’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 ? environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packag- ing allows relays to be integrated easily on boards designed for surface mount processing.
    • BGA Surface Mount
    • Ability to pass GHz signals
    • Rise time < 40 ?Sec
    • 50 ? Characteristic Impedance
    • Low Capacitance
    • Patented Design

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