Product Description
Description: Reed Relays Package: BGA Contact Form: 1A SPST-NO Coil Voltage: 5 VDC Switching Voltage: 125 Switching Current: 0.25 ES Shield: N/A RF Coax Shield: N/A
Product Information | Resources |
|
|
Specifications |
Product Attribute | Attribute Value |
Package | BGA |
Contact Form | 1A SPST-NO |
Coil Voltage | 5 VDC |
Switching Voltage | 125 |
Switching Current | 0.25 |
ES Shield | N/A |
RF Coax Shield | N/A |
Coil Resistance (? +/- 10%) | 150 |
Operate Voltage (VDC Max.) | 3.8 |
Release Voltage (VDC-Min.) | 0.4 |
Carry Current (Amps) | 0.5 |
Contact Rating (Watts) | 3 |
Life Expectancy-Typical (x106 Ops.) | 1000 |
Static Contact Resistance (max. init.) ? | 0.125 |
Dynamic Contact Resistance (max. init.) ? | 0.15 |
Insulation Resistance (minimum) - Between all Isolated Pins at 100V, 25°C, 40% RH | 1012 |
Capacitance - Across Contact | 0.2 pF |
Open Contact to Coil | 0.5 pF |
Closed contact to Coil | 1 pF |
Dielectric Strength (minimum) | Between Contacts: 150; Contacts to Coil: 1500; Contacts to Shield: 1500 |
Operate Time - including bounce At Nominal Coil Voltage, 30 Hz Square Wave (msec.) | 0.1 |
Release Time - Typical (msec.) | 0.03 |
Breakdown Voltage | 150 |
Switch Power (V/A) | 3 |
Series Features |
B10 RF Relays |
Series Description: Cotos Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology1 allows for shorter RF paths in a controlled 50 ? environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packag- ing allows relays to be integrated easily on boards designed for surface mount processing. |
|