Product Description
Description: IC PLCC Sockets • Type: DIP, 0.3" (7.62mm) Row Spacing • Number of Positions or Pins (Grid): 18 (2x9) • Pitch - Mating: 0.100" (2.54mm) • Mounting Type: Through Hole • Features: Open Frame
| Product Information | Resources |
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| Specifications |
| Product Attribute | Attribute Value |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 18 (2x9) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | Flash |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS) |
| Operating Temperature | -40°C ~ 105°C |